Intermetallic Reactions during the Solid-Liquid...

Intermetallic Reactions during the Solid-Liquid Interdiffusion Bonding of Bi2Te2.55Se0.45 Thermoelectric Material with Cu Electrodes Using a Sn Interlayer

Chuang, Chien-Hsun, Lin, Yan-Cheng, Lin, Che-Wei
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Volume:
6
Language:
english
Journal:
Metals
DOI:
10.3390/met6040092
Date:
April, 2016
File:
PDF, 4.36 MB
english, 2016
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