Utilization of a Porous Cu Interlayer for the Enhancement...

Metals 2016 / 09 Vol. 6; Iss. 9

Utilization of a Porous Cu Interlayer for the Enhancement of Pb-Free Sn-3.0Ag-0.5Cu Solder Joint

Jamadon, Nashrah, Tan, Ai, Yusof, Farazila, Ariga, Tadashi, Miyashita, Yukio, Hamdi, Mohd
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Volume:
6
Language:
english
Journal:
Metals
DOI:
10.3390/met6090220
Date:
September, 2016
File:
PDF, 5.06 MB
english, 2016
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