Stress-Free Bonding Technology with Pyrex for Highly...

Micromachines 2014 / 09 Vol. 5; Iss. 3

Stress-Free Bonding Technology with Pyrex for Highly Integrated 3D Fluidic Microsystems

Thoma, Florian, Goldschmidtböing, Frank, Cobry, Keith, Woias, Peter
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Volume:
5
Language:
english
Journal:
Micromachines
DOI:
10.3390/mi5030783
Date:
September, 2014
File:
PDF, 9.39 MB
english, 2014
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