Wafer-Level Packaging Method for RF MEMS Applications Using...

Wafer-Level Packaging Method for RF MEMS Applications Using Pre-Patterned BCB Polymer

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Volume:
9
Language:
english
Journal:
Micromachines
DOI:
10.3390/mi9030093
Date:
February, 2018
File:
PDF, 3.04 MB
english, 2018
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