Fabrication of Through via Holes in Ultra-Thin Fused Silica...

Micromachines 2018 / 03 Vol. 9; Iss. 3

Fabrication of Through via Holes in Ultra-Thin Fused Silica Wafers for Microwave and Millimeter-Wave Applications

Li, Xiao, Chan, King, Ramer, Rodica
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Volume:
9
Language:
english
Journal:
Micromachines
DOI:
10.3390/mi9030138
Date:
March, 2018
File:
PDF, 1.21 MB
english, 2018
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