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Thermal-stable void-free interface morphology and bonding mechanism of low-temperature Cu-Cu bonding using Ag nanostructure as intermediate
Liu, Ziyu, Cai, Jian, Wang, Qian, Wang, Zheyao, Liu, Lei, Zou, GuishengVolume:
767
Language:
english
Journal:
Journal of Alloys and Compounds
DOI:
10.1016/j.jallcom.2018.07.060
Date:
October, 2018
File:
PDF, 6.13 MB
english, 2018