Impact of TiN barrier layer on contact resistance of tungsten filled vias
Schulze, S., Wolansky, D., Katzer, J., Schubert, M. A., Costina, I., Mai, A.Year:
2018
Language:
english
Journal:
IEEE Transactions on Semiconductor Manufacturing
DOI:
10.1109/TSM.2018.2855656
File:
PDF, 1.46 MB
english, 2018