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Finite Element Analysis of Interfacial Debonding in Copper/Diamond Composites for Thermal Management Applications
Zain-ul-abdein, Muhammad, Ijaz, Hassan, Saleem, Waqas, Raza, Kabeer, Mahfouz, Abdullah Salmeen Bin, Mabrouki, TarekVolume:
10
Language:
english
Journal:
Materials
DOI:
10.3390/ma10070739
Date:
July, 2017
File:
PDF, 4.69 MB
english, 2017