Thermal characteristics of silicon wafer-based TVCs (thin...

International Journal of Heat and Mass Transfer 2018 / 12 Vol. 127

Thermal characteristics of silicon wafer-based TVCs (thin vapor chambers) with disk-shape using DI water

Kim, Soo Bin, Kim, Kyu Han, Jang, Seok Pil, Kedzierski, M.A.
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Volume:
127
Language:
english
Journal:
International Journal of Heat and Mass Transfer
DOI:
10.1016/j.ijheatmasstransfer.2018.06.100
Date:
December, 2018
File:
PDF, 2.38 MB
english, 2018
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