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A Modular Solder System with Hierarchical Morphology and Backward Compatibility
Lee, Han Bit, Kim, Young Won, Kim, Sang Hoon, Park, Suk Hee, Choi, Joon-Phil, Aranas, ClodualdoLanguage:
english
Journal:
Small
DOI:
10.1002/smll.201801349
Date:
July, 2018
File:
PDF, 3.84 MB
english, 2018