Effect of thickening outermost layers in Al/Ni multilayer film on thermal resistance of reactively bonded solder joints
Kanetsuki, Shunsuke, Kuwahara, Koichi, Egawa, Shouichi, Miyake, Shugo, Namazu, TakahiroVolume:
56
Language:
english
Journal:
Japanese Journal of Applied Physics
DOI:
10.7567/JJAP.56.06GN16
Date:
June, 2017
File:
PDF, 2.91 MB
english, 2017