All-round suppression of Cu6Sn5 growth in Sn/Cu joints by...

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Journal of Materials Science: Materials in Electronics 2018 / 7

All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles

Shang, Shengyan, Kunwar, Anil, Yao, Jinye, Wang, Yunpeng, Zhao, Ning, Huang, Mingliang, Ma, Haitao
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Language:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-018-9682-z
Date:
July, 2018
File:
PDF, 2.45 MB
english, 2018
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