Effect of Substrate Thickness on Interfacial Adhesive Strength and Thermal Residual Stress of Second-Generation High-Temperature Superconducting Tape Using Peel Test Modeling
Duan, Yujie, Gao, YuanwenLanguage:
english
Journal:
Cryogenics
DOI:
10.1016/j.cryogenics.2018.07.008
Date:
July, 2018
File:
PDF, 884 KB
english, 2018