![](/img/cover-not-exists.png)
A Cause of Cracking in the Under-Bump-Metallurgy Area of Flip Chips
Mirman, Boris, Bobrov, EmanuelVolume:
123
Year:
2001
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1400975
File:
PDF, 25 KB
english, 2001