A Cause of Cracking in the Under-Bump-Metallurgy Area of...

A Cause of Cracking in the Under-Bump-Metallurgy Area of Flip Chips

Mirman, Boris, Bobrov, Emanuel
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Volume:
123
Year:
2001
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1400975
File:
PDF, 25 KB
english, 2001
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