Bottom–Up Electrodeposition of Large-Scale Nanotwinned...

Materials 2018 / 02 Vol. 11; Iss. 2

Bottom–Up Electrodeposition of Large-Scale Nanotwinned Copper within 3D Through Silicon Via

Sun, Fu-Long, Liu, Zhi-Quan, Li, Cai-Fu, Zhu, Qing-Sheng, Zhang, Hao, Suganuma, Katsuaki
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Volume:
11
Language:
english
Journal:
Materials
DOI:
10.3390/ma11020319
Date:
February, 2018
File:
PDF, 1.42 MB
english, 2018
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