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Solid State Foaming of Nickel, Monel, and Copper by the Reduction and Expansion of NiO and CuO Dispersions
Atwater, Mark A., Luckenbaugh, Thomas L., Hornbuckle, B. Chad, Darling, Kristopher A.Language:
english
Journal:
Advanced Engineering Materials
DOI:
10.1002/adem.201800302
Date:
May, 2018
File:
PDF, 2.36 MB
english, 2018