[IEEE 2018 Symposium on Design, Test, Integration &...

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[IEEE 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - ROMA, Italy (2018.5.22-2018.5.25)] 2018 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) - Developing MEMS electric current sensors for end use monitoring of power supply: Part VIII - segmentation design and empirical analysis of piezoelectric layers based on cantilever beam structure

Liu, Yang, Chen, Yang, Wang, Dong F., Lin, Yuan, Yang, Xu, Liu, Huan, Hou, Yipeng, Shang, Xuesong, Zhao, Ziqi, Itoh, Toshihiro, Maeda, Ryutaro
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Year:
2018
Language:
english
DOI:
10.1109/DTIP.2018.8394240
File:
PDF, 896 KB
english, 2018
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