[IEEE 2018 19th International Conference on Thermal,...

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[IEEE 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Toulouse (2018.4.15-2018.4.18)] 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration

Labie, Riet, Duflos, Frederic, Vandevelde, Bart, Allaert, Bart, Lauwaert, Ralph, Willems, Geert
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Year:
2018
Language:
english
DOI:
10.1109/EuroSimE.2018.8369920
File:
PDF, 729 KB
english, 2018
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