The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
1996 Vol. 11; Iss. 7
Factors Controlling the Surface Morphology of Copper Foil for Printed Wiring Board Electrodeposited at High Speed.
OSAKA, Tetsuya, TAMURA, Keiu, SAKAKIBARA, Akira, OKINAKA, YutakaVolume:
11
Year:
1996
Language:
english
Journal:
The Journal of Japan Institute for Interconnecting and Packaging Electronic Circuits
DOI:
10.5104/jiep1995.11.487
File:
PDF, 4.03 MB
english, 1996