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[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Suntec City, Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - A novel hybrid 2D/Q-2D finite element method for power/ground plane analysis
Li, Ping, Jiang, Li Jun, Bagci, HakanYear:
2018
Language:
english
DOI:
10.1109/ISEMC.2018.8394073
File:
PDF, 165 KB
english, 2018