Bath Stability of Electroless NiB Plating Using DMAB as a...

Journal of Japan Institute of Electronics Packaging 2002 Vol. 5; Iss. 6

Bath Stability of Electroless NiB Plating Using DMAB as a Reducing Agent and Evaluation of Solder Wettability of Deposited Films.

TASHIRO, Katsuhiko, OHTAKA, Ken, YAMAMOTO, Seiji, KAWASHIMA, Satoshi, HONMA, Hideo
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Volume:
5
Year:
2002
Journal:
Journal of Japan Institute of Electronics Packaging
DOI:
10.5104/jiep.5.591
File:
PDF, 3.74 MB
2002
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