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AlN-to-Metal Direct Bonding Process Utilizing Sintering of Ag Nanoparticles Derived from the Reduction of Ag2O
Motoyama, Keita, Matsuda, Tomoki, Sano, Tomokazu, Hirose, AkioLanguage:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-018-6504-2
Date:
July, 2018
File:
PDF, 5.14 MB
english, 2018