![](/img/cover-not-exists.png)
[IEEE 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Mie, Japan (2018.4.17-2018.4.21)] 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) - Optimization of Ni and Bi levels in Sn-0.7Cu-xNi-yBi solders for improved interconnection reliability
Belyakov, S. A., Nishimura, T., Akaiwa, T., Sweatman, K., Nogita, K., Gourlay, C. M.Year:
2018
Language:
english
DOI:
10.23919/ICEP.2018.8374705
File:
PDF, 3.78 MB
english, 2018