Study of thermal buckling behavior of plain woven C/SiC...

Thin-Walled Structures 2018 / 10 Vol. 131

Study of thermal buckling behavior of plain woven C/SiC composite plate using digital image correlation technique and finite element simulation

Xu, Yingjie, Ren, Shixuan, Zhang, Weihong, Wu, Zhenqiang, Gong, Wenran, Li, Haibo
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Volume:
131
Language:
english
Journal:
Thin-Walled Structures
DOI:
10.1016/j.tws.2018.07.023
Date:
October, 2018
File:
PDF, 2.43 MB
english, 2018
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