[IEEE 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Toulouse (2018.4.15-2018.4.18)] 2018 19th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Simulation-based lifetime curve for a power module to extend parameter regime beyond testing limitations
Kashko, Tatyana, Schilling, OliverYear:
2018
Language:
english
DOI:
10.1109/EuroSimE.2018.8369886
File:
PDF, 506 KB
english, 2018