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Reliability of Fine Pitch Sn–3.8Ag–0.7Cu Flip Chip Solder Joints With Different Connection Pads on PCB
Li, Dezhi, Liu, Changqing, Conway, Paul P.Volume:
130
Year:
2008
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2837522
File:
PDF, 754 KB
english, 2008