Nondestructive Failure Analysis and Simulation of Encapsulated 0402 Multilayer Ceramic Chip Capacitors Under Thermal and Mechanical Loading
Wunderle, B., Braun, T., May, D., Michel, B., Reichl, H.Volume:
131
Year:
2009
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.3078187
File:
PDF, 654 KB
english, 2009