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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Advances in Wire Bonding Technology to Overcome Resonance Conditions
Shah, Aashish, Schulze, Gary, Brunner, Jon, Qin, Ivy, Chylak, Bob, Wong, NelsonYear:
2018
DOI:
10.1109/ECTC.2018.00223
File:
PDF, 514 KB
2018