![](/img/cover-not-exists.png)
[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - New Failure Mechanism in High Temperature Resin Materials
Guyenot, Michael, Maas, D., Ratchev, R., Khoshamouz, A., Gottwald, T., Kreuer, S.Year:
2018
DOI:
10.1109/ECTC.2018.00191
File:
PDF, 889 KB
2018