[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Solderless Leadframe Assisted Wafer-Level Packaging Technology for Power Electronics
Vladimirova, Kremena, Widiez, Julie, Letowski, Bastien, Perreau, Pierre, Enyedi, Gregory, Coudrain, Perceval, Rouger, Nicolas, Crebier, Jean-ChristopheYear:
2018
DOI:
10.1109/ECTC.2018.00193
File:
PDF, 820 KB
2018