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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Material Characterization of Advanced Cement-Based Encapsulation Systems for Efficient Power Electronics with Increased Power Density
Boettge, Bianca, Naumann, F., Behrendt, S., G. Scheibel, M., Kaessner, S., Klengel, S., Petzold, M., G. Nickel, K., Hejtmann, G., Z. Miric, A., Eisele, R.Year:
2018
DOI:
10.1109/ECTC.2018.00194
File:
PDF, 2.20 MB
2018