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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Effects of Epoxy Molding Compound on Electrical Resistance Degradation of Pd-Coated Cu Wire Bonds in the 175 °C to 225 °C Range
Hook, Michael David, Mayer, Michael, Hunter, StevanYear:
2018
DOI:
10.1109/ECTC.2018.00218
File:
PDF, 3.38 MB
2018