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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Molecular Dynamics Simulation of Microwelds Formation and Breakage During Ultrasonic Copper Wire Bonding
Long, Yangyang, He, Bo, Cui, Weizhe, Zhuang, Xiaoying, Twiefel, JensYear:
2018
DOI:
10.1109/ECTC.2018.00219
File:
PDF, 2.43 MB
2018