[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Development of a Polyimide/SiC-Whisker/Nano-Particles Composite with High Thermal Conductivity and Low Coefficient of Thermal Expansion as Dielectric Layer for Interposer Application

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