[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Experimentally Minimizing the Gap Distance Between Extra Tall Packages and PCB Using the Digital Image Correlation (DIC) Method
Pham, Van-Lai, Niu, Yuling, Wang, Jing, Wang, Huayang, Singh, Charandeep, Park, Seungbae, Zhong, Cheng, Koh, Sau Wee, Wang, Jifan, Shao, ShuaiYear:
2018
DOI:
10.1109/ECTC.2018.00241
File:
PDF, 6.80 MB
2018