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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Interfacial Strength Characterization and Simulation of the Stacked Copper-Polymer Structures in Fan-out Packages
Hsu, Chia-Kuei, Lin, Po-Yao, Lin, Wen-Yi, Yew, Ming-Chih, Yeh, Shu-Shen, Lee, Kuang-Chun, Wang, Jin-Hua, Lai, Po-Chen, Yang, Che-Chia, Jeng, Shin-PuuYear:
2018
DOI:
10.1109/ECTC.2018.00243
File:
PDF, 362 KB
2018