[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Improving Solder Joint Reliability for PoP Packages in Current Mobile Ecosystem
Dhandapani, Karthikeyan, Zheng, Jiantao, Roggeman, Brian, Hsu, MarcusYear:
2018
DOI:
10.1109/ECTC.2018.00248
File:
PDF, 1.52 MB
2018