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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - The Reliability and the Effect of NCA Trapping in Thermo-Compression Flip-Chip Solder Joints Fabricated Using Sn-Ag Solder Capped 40 µm Pitch Cu Pillar Bumps and Low Temperature Curable Non-Conductive Adhesive (NCA)
Park, Hwan-Pil, Kim, Seongchul, Lee, Taeyoung, Yoo, Sehoon, Kim, Young-Ho, Park, Jae-Yong ParkYear:
2018
DOI:
10.1109/ECTC.2018.00290
File:
PDF, 385 KB
2018