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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Investigation of Material Dynamic Processes During Shear Test of Aluminum Heavy Wire Bond Contacts
Klengel, Robert, Naumann, Falk, Tismer, Sebastian, Klengel, SandyYear:
2018
DOI:
10.1109/ECTC.2018.00303
File:
PDF, 1.12 MB
2018