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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - 3D Stacking Process with Thermo-Sonic Bonding Using Non-conductive Film
Yamatsu, Shigeru, Watanabe, Kazuki, Kanagawa, Naoki, Ishikawa, Takatoshi, Kojio, TeppeiYear:
2018
DOI:
10.1109/ECTC.2018.00307
File:
PDF, 864 KB
2018