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[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Three-Dimensional Simulation of Effects of Microstructure Evolution and Interfacial Delamination on Cu Protrusion in Copper Filled Through Silicon Vias by Combined Monte Carlo and Finite Element Methods
Liang, Shui-Bao, Ke, Chang-Bo, Wei, Cheng, Zhou, Min-Bo, Zhang, Xin-PingYear:
2018
DOI:
10.1109/ECTC.2018.00320
File:
PDF, 1.93 MB
2018