[IEEE 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) - Design, Fabrication and Characterization of a Novel TSV Interposer Integrated Inductor for RF Applications
Sun, Yunheng, Cai, Han, Li, Jiwei, Ma, Shenglin, Jin, Yufeng, Wang, Wei, Chen, Jing, Miao, Min, Hu, Liulin, He, ShuweiYear:
2018
DOI:
10.1109/ECTC.2018.00375
File:
PDF, 821 KB
2018