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[IEEE 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - Warsaw (2017.9.10-2017.9.13)] 2017 21st European Microelectronics and Packaging Conference (EMPC) & Exhibition - High-precision picosecond laser structuring on LTCC for silicon chip assembly with high electrical contact density
Gutzeit, Nam, Schulz, Alexander, Welker, Tilo, Wagner, Christoph, Schafer, Eric, Muller, JensYear:
2017
Language:
english
DOI:
10.23919/EMPC.2017.8346866
File:
PDF, 619 KB
english, 2017