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[IEEE 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Singapore (2018.5.14-2018.5.18)] 2018 IEEE International Symposium on Electromagnetic Compatibility and 2018 IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (EMC/APEMC) - Enabling the next generation USB 3.1 (Gen 2) in mobile devices
Srivastava, Nitin, Scogna, Antonio Ciccomancini, Shim, HwanwooYear:
2018
Language:
english
DOI:
10.1109/ISEMC.2018.8393730
File:
PDF, 1.11 MB
english, 2018