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[IEEE 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD) - Chicago, IL (2018.5.13-2018.5.17)] 2018 IEEE 30th International Symposium on Power Semiconductor Devices and ICs (ISPSD) - Chip-scale cooling of power semiconductor devices: Fabrication of Jet impingement design
Zhou, Feng, Jung, Ki Wook, Fukuoka, Yuji, Dede, Ercan M.Year:
2018
Language:
english
DOI:
10.1109/ISPSD.2018.8393716
File:
PDF, 2.22 MB
english, 2018