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[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Design and Parametric Study of Microfluidic Cooling Manifold for 2.5D-SICs with Dielectric Coolant
Hu, Yuanchen, Sarvey, Thomas, Bakir, Muhannad, Joshi, YogendraYear:
2018
Language:
english
DOI:
10.1109/ITHERM.2018.8419648
File:
PDF, 592 KB
english, 2018