An Investigation of Stresses Induced by Temperature...

An Investigation of Stresses Induced by Temperature Variation in Integrated Circuit Molding Process

Lin, Zone-Ching, Chen, Chang-Cheng
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Volume:
129
Year:
2007
Language:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.2429705
File:
PDF, 737 KB
english, 2007
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