High thermoelectric performance of melt-spun Cu x Bi 0.5 Sb...

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Acta Materialia 2018 / 7

High thermoelectric performance of melt-spun Cu x Bi 0.5 Sb 1.5 Te 3 by synergetic effect of carrier tuning and phonon engineering

Yoon, Jeong Seop, Song, Jae Min, Rahman, Jamil Ur, Lee, Soonil, Seo, Won Seon, Lee, Kyu Hyoung, Kim, Seyun, Kim, Hyun-Sik, Kim, Sang-il, Shin, Weon Ho
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Language:
english
Journal:
Acta Materialia
DOI:
10.1016/j.actamat.2018.07.067
Date:
July, 2018
File:
PDF, 1.07 MB
english, 2018
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