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[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Analytical Design Methodology for Liquid Based Cooling Solution for High TDP CPUs
Fan, Yuehong, Winkel, Casey, Kulkarni, Devdatta, Tian, WenbinYear:
2018
Language:
english
DOI:
10.1109/ITHERM.2018.8419562
File:
PDF, 1.14 MB
english, 2018