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[IEEE 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - San Diego, CA, USA (2018.5.29-2018.6.1)] 2018 17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) - Thermal Performance Comparison of Advanced 3D Packaging Concepts for Logic and Memory Integration in Mobile Cooling Conditions
Oprins, Herman, Cherman, Vladimir, Beyne, EricYear:
2018
Language:
english
DOI:
10.1109/ITHERM.2018.8419590
File:
PDF, 3.96 MB
english, 2018